Semiconductors
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Official or authoritative source verified·Last updated 2026-07-27

Trade Show Details
This Hangzhou semiconductor exhibition covers the chain from chip creation to industrial delivery: EDA and design, wafer fabrication, packaging and testing, equipment, materials and advanced packaging. Dedicated attention to AI chips, third-generation semiconductors, Chiplet and RISC-V gives the event a current technology-development focus rather than a general electronics profile.
The 2027 event is the second edition, following the inaugural exhibition held in 2026.
Use the official product scope and buyer-facing topics to decide whether the event belongs in your sourcing plan.
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Xiaoshan Airport City, Xiaoshan District, Hangzhou, China
Phase I exhibition area
Phase I entered operation
Major exhibitions and business events in its first full operating year
Other verified events with closely related product or buyer scope.
May 27, 2027 · Hangzhou, China
May 27, 2027 · Guangzhou, China
May 27, 2027 · Guangzhou, China