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2nd Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition 2027

May 27–29, 2027
Hangzhou, China
Hangzhou Grand Convention and Exhibition Center

Official or authoritative source verified·Last updated 2026-07-27

2nd Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition 2027 — Electronics, Electrical & Smart Technology
Xentra editorial cover based on official event facts.

Trade Show Details

Event Overview

This Hangzhou semiconductor exhibition covers the chain from chip creation to industrial delivery: EDA and design, wafer fabrication, packaging and testing, equipment, materials and advanced packaging. Dedicated attention to AI chips, third-generation semiconductors, Chiplet and RISC-V gives the event a current technology-development focus rather than a general electronics profile.

The 2027 event is the second edition, following the inaugural exhibition held in 2026.

What This Show Covers

Use the official product scope and buyer-facing topics to decide whether the event belongs in your sourcing plan.

Semiconductors

Explore suppliers, products and solutions connected with Semiconductors.

Integrated Circuits

Explore suppliers, products and solutions connected with Integrated Circuits.

Chip Manufacturing

Explore suppliers, products and solutions connected with Chip Manufacturing.

Electronic Materials

Explore suppliers, products and solutions connected with Electronic Materials.

Event Venue

Hangzhou Grand Convention and Exhibition Center
Hangzhou GrandHangzhou

Hangzhou Grand Convention and Exhibition Center

Xiaoshan Airport City, Xiaoshan District, Hangzhou, China

Exhibition Area
155,000 m²

Phase I exhibition area

Opened
2024

Phase I entered operation

Shows / Events
20+ / year

Major exhibitions and business events in its first full operating year

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