Semiconductor Packaging
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IC Packaging Fair 2026
- Oct 27–29, 2026
Official or authoritative source verified·Last updated 2026-07-22
Trade Show Details
Event Overview
IC Packaging Fair isolates the semiconductor back end from the much broader electronics-manufacturing landscape. Its useful scope runs through packaging materials, bonding and assembly equipment, inspection and test systems, and newer package formats, giving the event a clearer process-engineering focus than shows centred on chips, components or finished electronic products.
The fair is presented inside the NEPCON Asia platform, so its specialist packaging-and-test content sits alongside SMT, PCBA and smart-factory technologies without losing its own semiconductor-process identity.
What This Show Covers
Use the official product scope and buyer-facing topics to decide whether the event belongs in your sourcing plan.
Packaging Equipment
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Test & Inspection
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Advanced Packaging
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Event Venue
Shenzhen WorldShenzhen
Shenzhen World Exhibition & Convention Center
No. 1 Zhancheng Road, Fuhai Subdistrict, Bao'an District, Shenzhen, China
- Exhibition Area
- 400,000 m²
- Opened
- 2019
- Shows / Events
- 50+ / year
Phase I indoor exhibition space
Phase I entered operation
Public 2026 schedules list more than 50 trade fairs
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Sources & Update Log
- IC Packaging Fair 2026 ↗Verified 2026-07-22
