Official or authoritative source verified·Last updated 2026-09-07
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elexcon connects embedded-system design with the components and manufacturing services needed to turn a working prototype into a supplied product. Its scope spans processors, memory, modules, development tools, connectivity, sensors and power electronics, alongside PCB services, electronics manufacturing and advanced packaging. The useful distinction is between buying a chip, selecting a ready-to-integrate module and finding a partner to build the board or assembly. Engineering and purchasing teams can compare those routes against the same bill of materials, interface requirements and production volumes. Ask whether each supplier is the original manufacturer, an authorized distributor or a service provider, and examine software support and component availability before treating two offers as equivalent.
Use the official product scope and buyer-facing topics to decide whether the event belongs in your sourcing plan.
Processors, embedded modules and development boards support on-device computing, with operating systems and debugging tools addressing implementation. Compare a bare-chip design with a module-based route, taking account of software support, interface choices and the work still needed to reach a production-ready assembly.
Memory, wireless devices, MEMS sensors, power-management ICs and passive components cover different positions in the bill of materials. Separate component supply from PCB fabrication and assembly services, and check sourcing authorization, package compatibility and availability for repeat production rather than prototype quantities alone.
No. 1 Zhancheng Road, Fuhai Subdistrict, Bao'an District, Shenzhen, China
Phase I indoor exhibition space
Phase I entered operation
Public 2026 schedules list more than 50 trade fairs
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